Radiall Introduces New Board-to-Board RF Coaxial Interconnect Solutions
Featuring SMP-MAX for Maximum Mechanical Misalignment Tolerances

CHANDLER, AZ, September 14, 2009 /24-7PressRelease/ -- Radiall USA, Inc., is proud to introduce its new extensive range of cost effective board-to-board, module-to-module and panel-to-panel RF coaxial interconnect solutions developed for the telecommunications industry.

Radiall offers four different product groups and ten connector series including the new SMP-MAX, SMP-Spring, IMP-Spring as well as other misalignment solutions. They address the most demanding wireless telecom applications required for the new generation of infrastructure compact equipment such as base stations or handheld devices.

New SMP-MAX large misalignment solution has a patented impedance matching insulator that is optimized for a larger operating gap between connectors making it easier for engineers to handle a maximum board-to-board distance tolerance of up to .078" (2 mm) gap without a spring, which is 300 percent more than the standard SMP. It also features a 3 degree tilt (radial travel) and it has an operating frequency range of DC-6 GHz, a 1.2 max VSWR guaranteed up to 3 GHz and it can handle up to 165 Watts of power at 3 GHz.

Radiall's IMP-Spring, SMP-Spring and MMBX-Spring are ideal spring-loaded solutions for both increased board-to-board distance misalignment tolerances of up to .078" (2 mm) and a tilt (radial travel) of up to 4.5 degrees. In addition, these spring-loaded solutions have a consistent low VSWR, down to 1.15 at 3 GHz, and low RF leakage.
For more misalignment and other RF solutions, please contact your Radiall sales representative, distributor or visit www.radiall.com.

Press Release Contact Information:

Vincent Bonnassieux
Radiall USA, Inc.
RF Products Marketing Manager
6825 West Galveston Street
Chandler, Arizona
USA 85226
Voice: 203-776-2813 x107
Fax: 203-776-8294
Website: Visit Our Website